Description

Employer: Annapurna Labs (U.S.) Inc.
Position: ASIC II AMZ25487.3
Location: Austin, TX

Multiple Positions Available:

1. Develop detailed CFD and compact RC models for SoC and Package
thermal analysis
2. Knowledge of hardware and software based thermal / power
management control algorithms
3. Optimize air and liquid cooled thermal solutions under PPA and
system design constraints
4. Simulate and prototype thermal control strategies
5. Validate thermal models through power/thermal measurements on
Hardware
6. Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability
7. Identify, design, test and integrate new thermal-mechanical
technologies for large-scale server deployments to deliver a world
class customer experience.
8. Own thermal-mechanical design from the lowest levels of chip SOC
design to rack assembly and see those systems all the way through
to high volume manufacturing.
9. Domestic or international travel up to 25% to perform role
responsibilities may be required

(40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000)

Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation